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- RF 트랜시버 IC
RF 트랜시버 IC
제조업체
- Qualcomm
패키지
- QFN-32-EP(5x5)
- QFN-156
- QFN-40-EP(5x5)
- WLCSP-79(4.7x4.8)
- WLCSP-47(3.8x4)
- UFQFN-40-EP
- QFN-68(8x8)
- VFBGA-96(6x6)
- QFN-40
- TFBGA-169
- TFBGA-96(8x8)
- VFBGA-120(7x7)
- WLCSP-94(4.3x4.4)
- VFBGA-68(5.5x5.5)
- TFBGA-96
- QFN-80(8x8)
- BGA-34(2.4x2.5)
- QFN-56(8x8)
- WLCSP-67(4x4.1)
- VFBGA-112
- QFN-48(7x7)
- LFBGA-120
- BGA-105(6x6)
이득 대역폭 곱(GBP)
- -40℃~+105℃
- -
- -40℃~+85℃
- -30℃~+85℃
기술 유형
- -
- 1.8V~3.6V
- 1.7V~3.6V
- 3.3V
- 1.2V~3.6V
- 1.5V
- 3.1V~3.6V
총 고조파 왜곡
- -
입력
- USB
- -
- I2S
- I2C,SPI,UART
- I2C,I2S,SPI,UART,USB
- I2S,SPI,PCM,UART,USB
- I2C,SDIO,SPI,UART,USB
- I2C,I2S,UART,USB
- I2C,I2S,SPI,PCM,UART,USB
운전자 수
- 2Mbps
- 3Mbps
수신기 지연
- Bluetooth
일반적인 적용 빈도
- 20mA
- 45mA
전송 전류
- 2.4GHz
공통 모드 거부율
- -
- 18mA
- 45mA
유형
- -
- TxRx + MCU
- TxRx Only
- TxRx + MPU
작동 온도
- -
- -40°C ~ 85°C
- -40°C ~ 105°C
- -20°C ~ 85°C
- -30°C ~ 85°C
- -40°C ~ 150°C
등급
- -
자격
- -
공급자 장치 패키지
- -
- 32-QFN (5x5)
- 40-QFN (6x6)
- 48-QFN (7x7)
- 56-QFN (8x8)
- 68-QFN (8x8)
- 32-QFN (4x4)
- 47-WLCSP (3.75x3.95)
- 42-CSP (3.79x3.35)
- 67-WLCSP (4.12x4.04)
- 96-TFBGA (8x8)
- 120-VFBGA (7x7)
- 112-VFBGA (6.5x6.5)
- 79-WLCSP (4.73x4.84)
- 96-VFBGA (6x6)
- 68-VFBGA (5.5x5.5)
- 96-LFBGA (10x10)
- 80-QFN (8x8)
- 28-WLCSP (2.57x3.21)
- 36-LGA (5x5)
- 84-VFBGA (6x6)
- 90-BGA (5.6x5.9)
- 105-BGA (6x6)
- 94-WLCSP (4.38x4.26)
- 32-LGA (17.28x12.28)
- 36-LGA (12.28x19.8)
- 120-LFBGA (7x7)
- 36-LGA (12.28x23)
- 51-WLCSP (3.16x3.44)
- 105-LFBGA (10x10)
- 169-TFBGA (8x8)
- 34-BGA (2.51x2.38)
시리즈
- -
- *
- BlueCore®
- BlueCore® BC6130™
- BlueCore® BC6110™
- µEnergy®
- BlueCore® BC6140™
- BlueCore® CSR8670™
- BlueCore® BC6145™
- BlueCore® CSR8645™
- BlueCore® CSR8510™ A10
- Qualcomm® QCC30xx
- BlueCore® CSRB5348™
- Qualcomm® QCC74xM
- Qualcomm® QCC730M
- Qualcomm® QCC5100
- BlueCore5™ Multimedia
포장
- Bulk
- Tray
- Tape & Reel (TR):::Cut Tape (CT):::Digi-Reel®
- Tape & Reel (TR)
- Cut Tape (CT)
- Tape & Reel (TR):::Cut Tape (CT)
부품현황
- Active
- Obsolete
- Not For New Designs
패키지/케이스
- -
- 6-XFBGA
- 68-VFQFN Exposed Pad
- 48-VFQFN Exposed Pad
- 80-VFQFN Exposed Pad
- 56-VFQFN Exposed Pad
- 68-QFN
- 64-BGA
- 56-UFBGA, WLCSP
- 48-VQFN
- 169-TFBGA
- 47-WFBGA, WLCSP
- 40-UFQFN Exposed Pad
- 42-WFBGA, WLCSP
- 40-QFN
- 67-WFBGA, WLCSP
- 96-TFBGA
- 34-XFBGA, WLCSP
- 84-VFBGA
- 120-VFBGA
- 32-UFQFN Exposed Pad
- 112-VFBGA
- 79-UFBGA, WLCSP
- 96-VFBGA
- 68-VFBGA
- 96-LFBGA
- 28-UFBGA, WLCSP
- 36-WFLGA Exposed Pad
- 90-VFBGA
- 105-VFBGA
- 94-XFBGA, WLCSP
- 32-LGA Module
- 36-LGA Module
- 88-BGA, WLCSP
- 120-LFBGA
- 144-TFBGA
- 105-LFBGA
- 56-QFN
- 51-UFBGA, WLCSP
장착 유형
- Surface Mount
빈도
- -
- 2.4GHz
- 2.4GHz, 5GHz
전압 - 공급
- -
- 1.5V ~ 3.6V
- 3.6V
- 1.2V ~ 3.6V
- 2.7V ~ 5.5V
- 3.3V
- 1.8V ~ 3.6V
- 2.7V ~ 4.5V
- 1.8V
- 3.1V ~ 3.6V
- 1.7V ~ 3.6V
- 1.5V
- 2.97V ~ 3.63V
- 2.2V ~ 4.2V
- 2.7V ~ 4.4V
RF 제품군/표준
- -
- WiFi
- Bluetooth
- Bluetooth, WiFi
감광도
- -
- -105dBm
- -90dBm
- -85dBm
- -91dBm
- -86dBm
- -93dBm
- -88dBm
- -94dBm
- -87dBm
- -92.5dBm
- -85.5dBm
- -90.5dBm
데이터 속도(최대)
- -
- 54Mbps
- 2Mbps
- 72.2Mbps
- 2MBaud
- 3Mbps
- 12Mbps
- 4MBaud
- 723.2kbps
- 3.69Mbaud
- 28.9Mbps
전력 - 출력
- -
- 10dBm
- 8dBm
- 9dBm
- 16dBm
- 6dBm
- 7dbm
- 4dBm
- 5dBm
- 5.5dBm
- 7.5dBm
- 8.5dBm
- 9.7dBm
- 6.5dBm
메모리 크기
- -
- 8MB Flash
- 16MB Flash
- 4MB ROM, 48kB RAM
- 48kB RAM
- 64kB RAM, 64kB ROM
- 4MB ROM
- 6MB ROM, 48kB RAM
- 8MB ROM, 28kB RAM
- 8MB Flash, 32kB RAM
- 16MB Flash, 56kB RAM
- 8MB Flash, 48kB RAM
- 1kB ROM, 56kB RAM
- 56KB RAM
- 256KB Flash, 80KB RAM
- 4kB RAM
- 6MB Flash, 48kB RAM
- 128kB ROM, 484kB SRAM
- 8MB ROM, 48kB RAM
- 4MB Flash, 2.125MB RAM
- 112kB RAM, 448kB ROM
- 16MB Flash, 48kB RAM
- 4MB ROM, 32kB RAM
- 6MB Flash, 32kB RAM
현재 - 입고
- -
- 16mA
- 45mA
- 20mA
- 51mA ~ 64mA
DigiKey 프로그래밍 가능
- Not Verified
조정
- -
GPIO
- 20
- 22
- 16
- 14
- 13
- 15
- 19
- 35
- 2
전류 - 전송 중
- -
- 18mA
- 45mA
- 16mA
- 132mA
직렬 인터페이스
- I2C, I2S, SPI, UART, USB
- -
- I2C, SPI, UART
- I2S
- I2S, SPI, PCM, UART, USB
- I2C, I2S, SPI, PCM, UART, USB
- I2S, SPI, USB
- I2C, I2S, SPI, PCM, UART
- USB
- CANbus, I2C, I2S, PIO, SDIO, SPI, UART
- I2C, I2S, PIO, SDIO, SPI, UART
- I2C, SDIO, SPI, UART, USB
- I2C, I2S, UART, USB
규약
- Bluetooth v5.1
- Bluetooth v5.0
- 802.11a/b/g/n
- -
- 802.11b/g
- Bluetooth v3.0
- Bluetooth v4.2
- Bluetooth v4.1
- Bluetooth v4.0
- Bluetooth v2.0 +EDR
- Bluetooth v2.1 +EDR
- Bluetooth v2.1 +EDR, Class 2 and 3
- 802.11b/g/n
- Bluetooth v2.1 +EDR, Class 1
- Bluetooth v1.2, Class 2 and 3
- Bluetooth v2.0 +EDR, Class 1, 2 and 3
- Bluetooth v1.1, v1.2, Class 1, 2 and 3
- Bluetooth v2.0, Class 1, 2 and 3
- Bluetooth v2.0 +EDR, Class 2 and 3
- 802.11b/g/n/ax, Bluetooth v5.4
- Bluetooth v2.0, Class 2 and 3
제조업체
- Qualcomm
기본 제품 번호
- BC6130
- BC63B239
- CSR8311
- CSR8670
- CSR8675
- BC6145
- QCC-3021
- CSR8630
- CSR8635
- CSR8510
- CSR1024
- QCC-3040
- CSRB5348
- QCC-3046
- CSR8645
- BC41B143
- BC57E687
- CSR1011
- BC417143
- QCC-5141
- QCC-5144
- BC57G687
- BC57H687
- CSR6030
- CSRA67075
- CSR1013
- CSR1010
- CSR1012
- CSR8811
이미지 | 가격 | 수량 | 재고 상태 | 제조사 부품 번호 | eBee Part# | Manufacturer | Product Name | Description | RoHS | 패키지 | 포장 |
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